ADVANCED FIRE SUPPRESSION TECHNOLOGY

Heat-Activated Fire Suppression for Electrical Enclosures and Advanced Materials

FireXNull develops heat-activated microcapsule technology for localized, supplemental fire suppression in compatible electrical equipment and materials. Passive operation with no external power, sensors or wiring.

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01 / THE HIDDEN RISK

A Small Spark. A Hidden Fault. A Potentially Devastating Fire.

A loose connection, electrical arc or overheating component can become an ignition source inside an electrical cabinet.

In data centers and other critical facilities, faults may develop out of sight. A small, localized incident can lead to equipment damage, costly downtime or a much larger fire.

Electrical equipment in a data center where hidden connection faults can create fire risk — Illustrative equipment environment. Actual installation and fire risk depend on the application.

02 / THE FIREXNULL SOLUTION

Advanced Microcapsule Technology. Protection Where It Matters.

FireXNull uses heat-activated microcapsules containing FK-5-1-12 clean agent. When a product reaches its designed activation threshold, the capsules release the agent locally to provide supplemental fire suppression.

The technology is passive, with no external power, sensors, wiring or manual activation.

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Conceptual illustration · Scale, release and timing are illustrative.

01

Localized Heat

An electrical fault can generate abnormal heat inside compatible equipment.

02

Heat-Triggered Activation

Microcapsules respond when the product's designed activation threshold is reached.

03

Agent Release

Capsules release FK-5-1-12 clean agent near the heat source.

04

Clean, Localized Suppression

Residue-free and electrically non-conductive clean agent for localized supplemental fire suppression.

No powerNo external power required

No sensorsNo sensors or wiring

No residueFK-5-1-12 clean agent

Heat-activatedPreset product activation

Designed as supplemental protection. Not a replacement for code-required fire protection systems. Review applicable technical data sheets →

03 / FIREXNULL PRODUCT FAMILIES

Find the Right Fire Suppression Solution

Lane A: For Formulators and OEMs

FXN-M200 microcapsule fire suppression additive for compatible materials

FXN Additives (M Series)

FXN-M200 heat-activated microcapsule additive for formulation evaluation in compatible coatings, polymers, adhesives and composites. Integration and fire suppression performance require formulation-specific validation.

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Lane B: Ready-to-Install Products

FXN S Series stickers for compatible outlet boxes and electrical enclosures

FXN Sticker (S Series)

For electrical outlet and switch boxes, control panels and compatible electrical enclosures.

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FXN T Series suppression tape for wire connections and terminals

FXN Tape (T Series)

Heat-activated fire suppression tape for compatible wire connections, terminations and junctions.

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FXN R Series fire suppression rope for electrical control cabinets

FXN Rope (R Series)

Heat-activated fire suppression rope for compatible cabinets, panels and enclosed equipment.

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04 / APPLICATIONS

Designed Around Real-World Applications

Explore electrical and material applications where FireXNull technologies may provide localized supplemental fire suppression. Product suitability must be verified for each use.