Automatic, residue-free fire suppression.
Passive, heat-activated microcapsules for electrical enclosures and wire connections. No power, no sensors, no wiring, no pressure cylinders — and no residue.
For enclosed electrical systems and wire connections
Advanced microcapsule technology designed to suppress fires inside enclosed electrical environments.
FXN-R100
Flexible cord for electrical enclosures, control panels and server racks. Lay it along the risk.
FXN-SA4
Peel-and-stick pad for small electrical enclosures — outlets, switch and junction boxes.
FXN-T25
Wraps wire connections, terminals and splices — the joints where faults begin.
FXN-M200 Advanced Microcapsule Additive
Engineered for integration into compatible coatings and material systems — localized fire-suppression functionality built directly into your materials.
A heat-activated functional additive.
For evaluation in compatible coatings, resins, adhesives, sealants, composites and other material systems.
Integration guidance and evaluation support for qualified development projects.
Heat is the trigger. Nothing else is needed.
FireXNull develops heat-activated microcapsule products for localized protection inside enclosed electrical spaces and selected material systems.
The technology requires no external power, wiring, sensors, batteries, pressure cylinders, or manual activation.
Wherever current runs behind a closed door.
How to prevent electrical fires
Watch the microcapsules detect heat at the source and suppress a fire inside a closed enclosure — no one pressing a button.
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Upcoming expos
Come see a live demonstration and talk specification with our engineers — click any card for the full details.
Lombard, Illinois
National Harbor, Maryland
Las Vegas, Nevada
Las Vegas, Nevada
Protect the panel before it protects itself.
Talk to our team about specification, volume pricing, material integration, or distribution in your region.