FXN-M200 Advanced Microcapsule Additive

Engineered for integration into compatible coatings and material systems.

FXN-M200 is FireXNull’s heat-activated microcapsule additive developed for manufacturers, formulators, and R&D teams seeking to integrate localized fire-suppression functionality directly into their materials.

  1. Microcapsule-Based Technology: Heat-activated functional additive.
  2. Material Integration: Designed for evaluation in compatible coatings, resins, adhesives, sealants, composites, and other material systems.
  3. Technical Collaboration: Integration guidance and evaluation support available for qualified development projects
Clear glass beaker with yellow powder on a laboratory counter

Ready-to-Use Products for Enclosed Electrical Systems and Wire Connections

Advanced microcapsule technology designed to suppress fires inside enclosed electrical environments.

Available Through Authorized Sales Channels

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Defense Techconnect

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