Advanced fire-suppression materials

Heat-activated microcapsule technology for fire suppression.

FireXNull develops passive, heat-activated microcapsules that release a clean suppressant the moment heat is detected — no power, no sensors, no manual activation.

Explore the technology

0 W

External power required

No residue

Clean agent release

3 forms

Sticker · Rope · Tape

120°C

Typical activation point

01 — How it works

Heat is the trigger. Nothing else is needed.

FireXNull develops heat-activated microcapsule technology: passive protection that releases a clean suppressant agent the moment it detects heat.

No external power, wiring, sensors, batteries, pressure cylinders, or manual activation — just heat.

×Power ×Wiring ×Sensors ×Batteries ×Pressure cylinders ×Manual activation

See how it works

02 — Material integration

FXN-M200 Advanced Microcapsule Additive

Engineered for integration into compatible coatings and material systems — localized fire-suppression functionality built directly into your materials.

Discuss your application Request a sample

01

Protective coating system Demonstrated

FXN Microcapsules integrated into a compatible coating system and tested under direct flame exposure, releasing clean agent at the point of ignition.

02

2K polyurethane, epoxy & polyaspartic coatings Development opportunity

Available for evaluation. Compatibility and performance depend on your formulation and processing method.

03

Adhesives, sealants, resins & composites Development opportunity

Available for evaluation as a component-level additive in compatible material systems.

03 — Ready-to-use products

For enclosed electrical systems and wire connections

The same heat-activated microcapsule technology, built into finished products for electrical enclosures and wire connections.

Building your own product and need the additive directly? See material integration above. Need something ready to install today? Choose a product below.