FXN-M200 Advanced Microcapsule Additive

Engineered for integration into compatible coatings and material systems.

FXN-M200 is FireXNull's heat-activated microcapsule additive developed for manufacturers, formulators, and R&D teams seeking to integrate localized fire-suppression functionality directly into their materials.

  • Microcapsule-Based Technology: Heat-activated functional additive.
  • Material Integration: Designed for evaluation in compatible coatings, resins, adhesives, sealants, composites, and other material systems.
  • Technical Collaboration: Integration guidance and evaluation support available for qualified development projects.
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Ready-to-Use Products for Enclosed Electrical Systems and Wire Connections

Advanced microcapsule technology designed to suppress fires inside enclosed electrical environments.

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FireXNull Microcapsule-Based Fire Suppression Technology

FireXNull develops heat-activated microcapsule-based fire suppression products designed for localized protection inside enclosed electrical spaces and selected material systems.

Our ready-to-install products, including FXN Sticker, FXN Rope, and FXN Tape, are designed for electrical enclosures, control panels, breaker boxes, EV chargers, battery cabinets, server cabinets, HVAC units, and wire connections.

For manufacturers, formulators, chemical distributors, and R&D teams, FireXNull also offers FXN-M200 Microcapsules for evaluation as a fire-suppression additive in compatible coatings, polymers, resins, adhesives, sealants, composites, and OEM material systems.

The technology requires no external power, wiring, sensors, batteries, pressure cylinders, or manual activation.

How to Prevent Electrical Fires

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