Clear glass beaker with yellow powder on a laboratory counter

Microcapsule-Based Fire Suppression Additive

FXN Microcapsules are heat-activated clean-agent additives designed for evaluation in compatible coatings, polymers, resins, composites, adhesives, sealants, and specialty material systems.

  • Heat-activated microcapsule additive
  • Contains FK-5-1-12 clean agent
  • No wiring, sensors, pressure, or power required
  • Residue-free and electrically non-conductive
  • Designed for evaluation in compatible material systems
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Target Applications & Industries

FXN Microcapsules are designed for companies that want to evaluate fire-suppression functionality inside their own materials, systems, or products.

Relevant evaluation partners include:

  • Coating manufacturers
  • Paint and protective coating companies
  • Polymer and resin manufacturers
  • Adhesive and sealant companies
  • Composite material companies
  • Electrical component manufacturers
  • Battery and energy storage product developers
  • OEM product development teams
  • Specialty chemical distributors
  • Industrial safety product companies

Evaluation Fit:

If your company makes coatings, polymers, resins, adhesives, composites, or electrical components, FXN Microcapsules may be evaluated as an additive to help add localized, heat-activated fire-suppression functionality into compatible material systems. Final performance depends on your formulation, processing method, loading level, and application testing.

The Need for Material-Level Fire Suppression

Many fire risks begin inside compact or hard-to-access areas, including electrical components, coated surfaces, battery-adjacent materials, wires, connectors, and polymer-based assemblies.

Traditional fire suppression systems often protect the surrounding space, but they may not provide localized protection directly inside the material or component where overheating begins.

FXN Microcapsules are designed to help add localized, heat-responsive fire-suppression functionality directly into compatible material systems.

How the Technology Works

FXN Microcapsules are engineered to remain stable inside compatible material systems under normal conditions. When the surrounding temperature reaches the designed activation range, the capsule shell ruptures and releases FK-5-1-12 clean agent locally at the heat source.

This localized release helps interrupt the early fire development process without requiring sensors, wiring, pressure vessels, or external power.

The technology is designed for evaluation in coatings, polymers, resins, composites, adhesives, and specialty material systems where built-in, heat-activated fire-suppression functionality may provide added protection.

Stable under normal storage and use conditions

Heat-activated capsule shell rupture

Local release of FK-5-1-12 clean agent

No sensors, wiring, or external power required

Residue-free and electrically non-conductive agent

Designed for material-level integration and evaluation

Inside the Technology

FXN Microcapsules are produced through a microencapsulation process in which FK-5-1-12 clean agent is enclosed within a heat-responsive polymer shell.

The video shows how the polymer shell forms around the clean agent, creating a stable microcapsule structure designed to remain intact under normal conditions. When exposed to the designed activation temperature, the shell ruptures and releases the clean agent locally at the heat source.

What the Video Shows

  • Formation of the polymer shell around the clean agent
  • Creation of stable microcapsules through encapsulation
  • Heat-triggered shell rupture at the activation temperature
  • Local release of FK-5-1-12 clean agent
  • Fire suppression activity at the heat source
  • Residue-free and electrically non-conductive clean-agent performance

Final performance depends on the host material, formulation chemistry, capsule loading, film thickness, processing method, and application-specific testing.

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Fire Suppression Performance in Action

This video demonstrates FXN Microcapsules applied in a compatible coating system and tested under direct flame exposure.

The coated sample shows how the heat-activated microcapsules release FK-5-1-12 clean agent when exposed to elevated temperature, helping suppress fire activity at the coated surface.

The demonstration highlights the potential of FXN Microcapsules to add localized, heat-responsive fire-suppression functionality into compatible coating and material systems.

What the Video Shows

  • FXN Microcapsules integrated into a coating system
  • Direct flame exposure on the coated surface
  • Heat-triggered clean-agent release
  • Localized suppression activity at the fire source
  • Residue-free clean-agent performance
  • Potential use in compatible coatings, polymers, and specialty materials

Performance may vary depending on coating chemistry, capsule loading, film thickness, substrate, application method, and test conditions. Final suitability must be validated by the manufacturer or formulator for the intended application.

Technical & Engineering Details

FXN Microcapsules are supplied as a component-level additive for evaluation. Final performance depends on host formulation, capsule loading, film thickness, processing conditions, substrate, and application-specific testing.

Technical Specifications

  • Capsule size: 100–300 microns
  • Activation temperature: 194–284°F
  • Agent: FK-5-1-12 clean agent
  • Form: powder / additive

Material Compatibility

  • 2K polyurethane coating systems
  • Epoxy coating systems
  • Polyaspartic coating systems
  • Adhesives and sealants
  • Polymers, resins, and composites
  • Specialty industrial material systems
    Compatibility and performance must be validated by the formulator based on chemistry, processing conditions, and target application.

Potential Applications

  • Protective coatings
  • Industrial coating systems
  • Battery-adjacent materials
  • Electrical components and enclosures
  • Wire and connector protection materials
  • Polymer parts and molded components
  • Adhesives, sealants, and specialty formulations
  • OEM material development

Ready to Evaluate FXN Microcapsules?

Work with FireXNull to evaluate microcapsule-based fire suppression technology for compatible coatings, polymers, resins, composites, adhesives, sealants, and OEM material systems.

Our team can provide technical documents, sample availability, and basic evaluation guidance to help determine whether FXN Microcapsules may fit your product line or application.

Request Evaluation Sample

Technology in Real Products

Built on the microcapsule technology, these products deliver automatic fire suppression directly inside electrical systems and components.

FXN-Sticker

Adhesive fire suppression solution for small electrical enclosures and tight spaces.

More info

FXN Rope

Flexible fire suppression solution for larger enclosures and complex layouts.

More info

FXN Tape

Heat-responsive fire suppression tape for protecting wire connections and critical electrical points.

More info

Start Your Technical Review

FXN Microcapsules are available for qualified technical evaluation in compatible coatings, polymers, resins, composites, adhesives, sealants, and OEM material systems.

Request the TDS, SDS, sample availability, or a short technical discussion to help determine the right next step for your application.

Request Technical Documents & Samples