Each microcapsule contains FK-5-1-12 clean agent.When temperature rises, capsules rupture and release the agent directly at the ignition point, suppressing fire instantly.
Inside the Technology
See how microcapsules are formed and how the clean agent is encapsulated inside a polymer shell.
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Real-World Fire Suppression in Action
See how microcapsule technology activates instantly when exposed to heat, releasing a clean agent directly at the ignition point to suppress fire at its source without power, wiring, or residue.
Technical & Engineering Details
Technical Specifications
Capsule size: 10–300 microns
Activation temperature: 194–284°F
Agent: FK-5-1-12 clean agent
Form: powder / additive
Material Compatibility
Polyurethane (recommended)
Epoxy (lower performance)
Coatings and adhesives
Polymers and composites
Integration Guidelines
Mix immediately before application
Do not store pre-mixed long-term
Avoid high shear mixing
Maintain capsule integrity
Applications
Coatings
EV battery systems
Electrical components
Industrial materials
Ready to Integrate This Technology?
Work with our engineering team to integrate microcapsule fire suppression into your products, coatings, or systems.